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Package Intersil W4x4.16E

Package Intersil W4x4.16E

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x4.16E

4x4 Array 16 Balls With 0.40 Pitch Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x4.16E
    4X4 ARRAY 16 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
    Rev 0, 2/13
    X 1.200 1.780В±0.030 Y D
    C 16x 0.265В±0.035 1.780В±0.030 0.200 B
    0.400
    A
    0.290
    1 0.10 TOP VIEW (4X) 3 4 BOTTOM VIEW PIN 1
    (A1 CORNER) 0.240 2 0.290 PACKAGE
    OUTLINE 0.400 0.040 BSC
    (BACK SIDE COATING)
    0.290 0.540В±0.050
    0.05
    3 NSMD 0.200В±0.030 0.265В±0.035 Z Z SEATING
    PLANE TYPICAL RECOMMENDED LAND PATTERN
    0.10
    0.05 ZXY
    Z
    SIDE VIEW NOTES: 1 1. All dimensions are in millimeters. 2. Dimension and tolerance conform to ASMEY14.5-1994,
    and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per
    Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf ...
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