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Package Intersil W4x5.20H

Package Intersil W4x5.20H

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20H

20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20H
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 05/14 1.200
    X Y 0.400 1.67В±0.030
    E
    D 20x 0.265В±0.035 C 2.07В±0.030 1.600 B 0.235 A
    (4X) 0.10 1
    0.200
    TOP VIEW 2 3 4
    0.235 PIN 1
    (A1 CORNER) BOTTOM VIEW PACKAGE
    OUTLINE Z
    0.05 Z 0.240 SEATING PLANE
    3 0.400
    0.265В±0.035 x20 0.290 0.10
    0.05 ZXY
    Z 0.200В±0.030
    0.500В±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z .
    3. Primary datum Z and seating plane are defined by the spherical ...
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