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Package Intersil W4x5.20J

Package Intersil W4x5.20J

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20J

20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20J
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) пЂ 
    Rev 1, 1/15 X
    Y 0.400 1.64 В± 0.030 E
    D 20x 0.265 В±0.035
    2.18 В±0.030 C
    B
    A (4X) 0.10
    PIN 1
    (A1 CORNER) TOP VIEW 0.290
    1 2 3 4 0.200 0.220
    BOTTOM VIEW Z
    0.240 0.05 Z PACKAGE OUTLINE SEATING PLANE
    3 0.400
    0.290 2
    0.265 В±0.035 x20
    0.10
    0.05 Z X Y
    Z 4 0.200 В±0.030 6 NSMD 0.500 В±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASMEY 14.5 -1994.
    2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
    3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. ...
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