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Package Intersil W5x8.40A

Package Intersil W5x8.40A

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x8.40A

40 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x8.40A
    40 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 2/15
    X 2.06 В± 0.030
    1.600 Y
    H
    40x 0.265 В±0.035 G
    F
    2.800 E 3.26 В± 0.030 D
    C
    B
    (4X) 0.230 A 0.10 1 PIN 1
    (A1 CORNER) TOP VIEW 2 3 4 5
    0.230 0.400
    BOTTOM VIEW PACKAGE OUTLINE 0.240 0.05 Z Z SEATING PLANE
    3 0.400
    0.290
    2
    0.265 В±0.035
    0.10
    0.05 ZXY
    Z 4 6 NSMD 0.200 В±0.030 TYPICAL RECOMMENDED LAND PATTERN 0.500 В±0.050 ...
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