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Package Intersil W6x6.36

Package Intersil W6x6.36

ManufacturerIntersil
SeriesWLCSP
Part NumberW6x6.36

6x6 Array 36 Ball Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Wafer Level Chip Scale Package (WLCSP) W6x6.36
    6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID
    D TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 В±0.030 A2 0.305 В±0.025 b 0.270 В±0.030 D 2.530 В±0.020 D1 2.000 BASIC E 2.530 В±0.020 E1 2.000 BASIC e 0.400 BASIC SD 0.200 BASIC SE 0.200 BASIC
    Number of Bumps: 36
    Rev. 0 6/08 NOTES:
    1. Dimensions are in millimeters.
    A
    A2
    A1
    b SIDE VIEW E1
    SE
    e SD
    D1 b BOTTOM VIEW 1 ...
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