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Package Intersil W6x7.42B

Package Intersil W6x7.42B

ManufacturerIntersil
SeriesWLCSP
Part NumberW6x7.42B

42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W6x7.42B
    42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 1/17
    X 0.400 2.570 В±0.030 Y G
    42X 0.265 В±0.035 F
    E 2.919 В±0.030 D
    C
    B 0.260 A
    (4X) 0.10 1 2 3 4 6 5 0.200 TOP VIEW
    PIN 1
    (A1 CORNER) 0.285
    BOTTOM VIEW 0.215 0.05 Z PACKAGE OUTLINE Z SEATING PLANE
    3 0.265
    4
    0.265 В±0.035
    0.10
    0.05 0.400 5 6 NSMD 0.200 В±0.030 RECOMMENDED LAND PATTERN
    0.500 В±0.050
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance per ASME Y14.5M-1994.
    3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. ...

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