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Package Intersil W6x9.54

Package Intersil W6x9.54

ManufacturerIntersil
SeriesWLCSP
Part NumberW6x9.54

54 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W6x9.54
    54 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 10/15 X 2.551 В±0.030 Y 0.400
    J
    54x 0.265 В±0.035 H
    G
    F 3.670 В±0.030 E
    D
    C 0.235 B
    A
    (4X) 1 2 3 4 5 6 0.10 TOP VIEW PIN 1
    (A1 CORNER) 0.276 0.200
    BOTTOM VIEW PACKAGE
    OUTLINE 0.215 0.400 0.05 Z Z SEATING PLANE
    3 0.265
    0.265 В±0.035
    0.10
    0.05 6 NSMD 0.200 В±0.030
    0.500 В±0.050 TYPICAL RECOMMENDED LAND PATTERN
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance per ASME Y 14.5M -1994. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. ...
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