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Package Intersil W7x8.52

Package Intersil W7x8.52

ManufacturerIntersil
SeriesWLCSP
Part NumberW7x8.52

7x8 Array 52 Balls With 0.40 Pitch Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W7x8.52
    7X8 ARRAY 52 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
    Rev 1, 10/14
    Y X 0.400 3.14 В±0.030 H
    G
    52x 0.265 В±0.035 F
    E 3.54 В±0.030 D
    C
    0.370 B
    A
    0.10 (4X) 1
    2
    0.400 PIN 1 (A1 CORNER) 3 4 5 6 7 0.370 TOP VIEW
    BOTTOM VIEW 0.05 PACKAGE
    OUTLINE 0.240 Z Z SEATING PLANE
    5
    0.265 В±0.035 4
    0.10
    ZXY
    0.05
    Z 0.290
    0.400 0.200 В±0.030 ...
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