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Package Intersil W7x8.56A

Package Intersil W7x8.56A

ManufacturerIntersil
SeriesWLCSP
Part NumberW7x8.56A

56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W7x8.56A
    56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
    Rev 0, 6/14
    X Y 2.400 3.22 В±0.030
    H
    G
    56x 0.265 В±0.035 F
    E 3.37 В±0.030 2.800
    D
    0.400
    C
    B 0.285 A
    (4x) 0.10 1 2 3 4 5 6 7 PIN 1 (A1 CORNER)
    0.410 0.400
    TOP VIEW
    BOTTOM VIEW Z
    0.05 Z PACKAGE OUTLINE SEATING PLANE
    3 0.240 0.290
    2
    0.265 В±0.035
    0.10 M Z X Y
    0.05 M Z 0.400 4 0.200 В±0.030 6 NSMD ...

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