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Package Intersil W8x8.64

Package Intersil W8x8.64

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x8.64

8x8 Array 64 Balls Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W8x8.64
    8x8 Array 64 Balls Wafer Level Chip Scale Package
    Rev 0, 4/14
    X 4.025 В± 0.030 Y 0.500
    64x 0.320 В± 0.030 H
    G
    F 4.025 В± 0.030 E
    D
    C
    B
    0.263
    A (4X) 0.10 1 2 3 4 5 6 0.250 PIN 1 (A1 CORNER) 7 8 0.263 TOP VIEW
    BOTTOM VIEW PACKAGE OUTLINE 0.330 0.05 Z Z SEATING PLANE
    3 0.500 0.280 0.320 В± 0.030
    0.10 M Z X Y
    0.05 M Z 0.240 В± 0.030
    0.600 В± 0.060mm TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance conform to ASMEY14.5-1994.
    3. NSMD refers to non-solder mask defined pad design per
    Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf 1 ...
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