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Package Intersil W8x8.64A

Package Intersil W8x8.64A

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x8.64A

8x8 Array 64 Balls Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W8x8.64A
    8x8 Array 64 Balls Wafer Level Chip Scale Package (WLCSP) 0.5mm Pitch (BSC)
    Rev 0, 7/14
    X 4.025 В± 0.030 Y 0.500
    64x 0.320 В± 0.030 H
    G
    F 4.025 В± 0.030 E
    D
    C
    B
    0.263
    A (4X) 0.10 1 2 3 4 5 6 0.250 PIN 1 (A1 CORNER) 7 8 0.263 TOP VIEW
    BOTTOM VIEW 0.05 Z
    PACKAGE
    OUTLINE 0.330 Z SEATING PLANE
    3 0.040 (BSC)
    (BACKSIDE COATING) 0.500 0.280 0.320 В± 0.030
    0.10 M Z X Y
    0.05 M Z 0.240 В± 0.030
    0.640 В± 0.060 TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance conform to ASMEY14.5-1994. ...

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