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Package Intersil W8x9.72A

Package Intersil W8x9.72A

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x9.72A

72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W8x9.72A
    72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
    Rev 0, 2/15
    X Y 0.400
    3.270В±0.030
    J
    72x 0.265 В±0.035 H
    G
    F
    E 3.670 В±0.030 D
    C
    B 0.2350 A
    (4X) 0.10 1
    TOP VIEW PIN 1 (A1 CORNER) 2 3 4 5 7 6 8
    0.2350 0.200
    BOTTOM VIEW 0.05 Z PACKAGE OUTLINE 0.240 Z SEATING PLANE
    3 0.290
    2
    0.265 В±0.035
    0.10
    0.05 0.400 4 6 NSMD 0.200 В±0.030
    RECOMMENDED LAND PATTERN 0.500 В±0.050 ...
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