Package Intersil W9x11.99 99 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch) Package Outline Drawing (POD)- Download », PDF, 281 Kb
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W9x11.99
99 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Rev 0, 10/15
X Y 4.00 В±0.030
0.400
L
99x 0.265 В±0.035 K
J
H
G 4.80 В±0.030 F
E
D
C
0.400 B
A
(4X) 0.10 1 TOP VIEW PIN 1
(A1 CORNER) 2 3 4 5 6 7 8 9
0.400 0.400
BOTTOM VIEW 0.05 Z PACKAGE OUTLINE 0.215 Z SEATING PLANE
3 0.400 0.265 0.265 В±0.035
0.10
0.05 0.200 В±0.030 6 NSMD ...
Parametrics| Family | WLCSP-TKCURDL |
|---|
| Pin Count | 99 |
|---|
| Length | 4.80 mm |
|---|
| Width | 4.00 mm |
|---|
| Thickness | 0.50 mm |
|---|
| Height max | 0.55 mm |
|---|
| Pitch | 0.40 mm |
|---|
| Lead Free Peak Temperature | 260 °C |
|---|
| Package Index | W9X11.99 |
|---|
Moldel LineSeries: WLCSP (80) Manufacturer's ClassificationRelated datasheets: - Datasheet LF356H - National Semiconductor IC, OP AMP, JFET, TO-99-8, 356
- Datasheet LM4562HA/NOPB - National Semiconductor OP AMP AUDIO DUAL HF TO-99, POWERWISE
- Datasheet AD549KH - Analog Devices IC, OP-AMP, 1 MHz, 3 V/µs, TO-99-8
- Datasheet OP77FJ - Analog Devices IC, OP-AMP, 600 kHz, 0.3 V/µs, TO-99-8
- Datasheet LME49710HA/NOPB - National Semiconductor IC, AUDIO OP-AMP, 55 MHz, TO-99-8
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