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Package Intersil W9x11.99

Package Intersil W9x11.99

ManufacturerIntersil
SeriesWLCSP
Part NumberW9x11.99

99 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W9x11.99
    99 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
    Rev 0, 10/15
    X Y 4.00 В±0.030
    0.400
    L
    99x 0.265 В±0.035 K
    J
    H
    G 4.80 В±0.030 F
    E
    D
    C
    0.400 B
    A
    (4X) 0.10 1 TOP VIEW PIN 1
    (A1 CORNER) 2 3 4 5 6 7 8 9
    0.400 0.400
    BOTTOM VIEW 0.05 Z PACKAGE OUTLINE 0.215 Z SEATING PLANE
    3 0.400 0.265 0.265 В±0.035
    0.10
    0.05 0.200 В±0.030 6 NSMD ...
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