PDF, 281 Kb
Docket
Plastic Packages for Integrated Circuits Package Outline Drawing
W9x11.99
99 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Rev 0, 10/15
X Y 4.00 В±0.030
0.400
L
99x 0.265 В±0.035 K
J
H
G 4.80 В±0.030 F
E
D
C
0.400 B
A
(4X) 0.10 1 TOP VIEW PIN 1
(A1 CORNER) 2 3 4 5 6 7 8 9
0.400 0.400
BOTTOM VIEW 0.05 Z PACKAGE OUTLINE 0.215 Z SEATING PLANE
3 0.400 0.265 0.265 В±0.035
0.10
0.05 0.200 В±0.030 6 NSMD …