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Package Intersil W9x9.62

Package Intersil W9x9.62

ManufacturerIntersil
SeriesWLCSP
Part NumberW9x9.62

9x9 Array 62 Balls with 0.40 Pitch Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W9x9.62
    9X9 ARRAY 62 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
    Rev 0, 2/13
    3.200
    3.690В±0.030 Y 0.400 X
    I
    H
    G
    F 3.690В±0.030 3.200 E 0.400 D
    C
    B
    A
    0.10
    1 (4X) TOP VIEW 0.400 3 4 5 6 7 8 9 BOTTOM VIEW PIN 1
    (A1 CORNER) 0.290 2 PACKAGE
    OUTLINE 0.240 0.500В±0.050
    0.265В±0.035 x 62
    0.200В±0.030 0.10
    0.05 ZXY
    Z SEATING
    Z PLANE
    0.05 Z SIDE VIEW 3 NSMD ...
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