Datasheet HMC8120 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 71 GHz to 76 GHz, E-Band Variable Gain Amplifier |
| Pages / Page | 16 / 6 — HMC8120. Data Sheet. INTERFACE SCHEMATICS. VDD6, VDD5, VDD4,. VDD3, VDD2, … |
| Revision | A |
| File Format / Size | PDF / 362 Kb |
| Document Language | English |
HMC8120. Data Sheet. INTERFACE SCHEMATICS. VDD6, VDD5, VDD4,. VDD3, VDD2, VDD1. GND. RFIN. 1.6kΩ. GG6 TO VGG3,. VGG1/VGG2. RFOUT
Model Line for this Datasheet
Text Version of Document
HMC8120 Data Sheet INTERFACE SCHEMATICS VDD6, VDD5, VDD4, VDD3, VDD2, VDD1 GND
003 007 50- 50- 131 131 Figure 3. GND Interface Figure 7. VDD6 to VDD1 Interface
RFIN
4
1.6kΩ
00
V
-008 0-
GG6 TO VGG3,
15
VGG1/VGG2
13150 13 Figure 4. RFIN Interface Figure 8. VGG6 to VGG3, VGG1/VGG2 Interface
RFOUT
9
1.6kΩ
05 00 0 0- 0- 15 15
VCTL2, VCTL1
13 13 Figure 5. RFOUT Interface Figure 9. VCTL2, VCTL1 Interface 10 06 -0 -0
V ENV
150
DET, VREF
150
DET
13 13 Figure 6. V Figure 10. ENV DET, VREF Interface DET Interface Rev. A | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
003 007 50- 50- 131 131 Figure 3. GND Interface Figure 7. VDD6 to VDD1 Interface
RFIN
4
1.6kΩ
00
V
-008 0-
GG6 TO VGG3,
15
VGG1/VGG2
13150 13 Figure 4. RFIN Interface Figure 8. VGG6 to VGG3, VGG1/VGG2 Interface
RFOUT
9
1.6kΩ
05 00 0 0- 0- 15 15
VCTL2, VCTL1
13 13 Figure 5. RFOUT Interface Figure 9. VCTL2, VCTL1 Interface 10 06 -0 -0
V ENV
150
DET, VREF
150
DET
13 13 Figure 6. V Figure 10. ENV DET, VREF Interface DET Interface Rev. A | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
