RA2L2 Datasheet 1. Overview Table 1.8AnalogFeatureFunctional description 12-bit A/D Converter (ADC12) A 12-bit successive approximation A/D converter is provided. Up to 17 analog input channels are selectable. Temperature sensor output and internal reference voltage are selectable for conversion. Temperature Sensor (TSN) The on-chip Temperature Sensor (TSN) determines and monitors the die temperature for reliable operation of the device. The sensor outputs a voltage directly proportional to the die temperature, and the relationship between the die temperature and the output voltage is fairly linear. The output voltage is provided to the ADC12 for conversion and can be further used by the end application. Table 1.9Data processingFeatureFunctional description Cyclic Redundancy Check (CRC) The Cyclic Redundancy Check (CRC) generates CRC codes to detect errors in the data. The calculator bit order of CRC calculation results can be switched for LSB-first or MSB-first communication. Additionally, various CRC-generation polynomials are available. The snoop function allows the access to specific addresses to be monitored. This function is useful in applications that require CRC code to be generated automatically in certain events, such as monitoring writes to the serial transmit buffer and reads from the serial receive buffer. Data Operation Circuit (DOC) The Data Operation Circuit (DOC) compares, adds, and subtracts 16-bit data. When a selected condition applies, 16-bit data is compared and an interrupt can be generated. Table 1.10I/O portsFeatureFunctional description I/O ports ● I/O ports for the 64-pin LQFP – I/O pins: 51 – Input pins: 3 – Pull-up resistors: 51 – N-ch open-drain outputs: 38 – 5-V tolerance: 7 ● I/O ports for the 48-pin LQFP/HWQFN – I/O pins: 35 – Input pins: 3 – Pull-up resistors: 35 – N-ch open-drain outputs: 24 – 5-V tolerance: 7 ● I/O ports for the 32-pin LQFP/HWQFN – I/O pins: 21 – Input pins: 3 – Pull-up resistors: 21 – N-ch open-drain outputs: 13 – 5-V tolerance: 5 R01DS0445EJ0110 Rev.1.10 Page 5 of 108 Mar 12, 2025 Document Outline Features 1. Overview 1.1 Function Outline 1.2 Block Diagram 1.3 Part Numbering 1.4 Function Comparison 1.5 Pin Functions 1.6 Pin Assignments 1.7 Pin Lists 2. Electrical Characteristics 2.1 Absolute Maximum Ratings 2.2 DC Characteristics 2.2.1 Tj/Ta Definition 2.2.2 I/O VIH, VIL 2.2.3 I/O IOH, IOL 2.2.4 I/O VOH, VOL, and Other Characteristics 2.2.5 Operating and Standby Current 2.2.6 VCC Rise and Fall Gradient and Ripple Frequency 2.2.7 Thermal Characteristics 2.3 AC Characteristics 2.3.1 Frequency 2.3.2 Clock Timing 2.3.3 Reset Timing 2.3.4 Wakeup Time 2.3.5 NMI and IRQ Noise Filter 2.3.6 I/O Ports, POEG, GPT, AGTW, KINT, and ADC12 Trigger Timing 2.3.7 CAC Timing 2.3.8 SCI Timing 2.3.9 SPI Timing 2.3.10 I3C Timing 2.3.11 SSIE Timing 2.3.12 UARTA Timing 2.3.13 CLKOUT Timing 2.4 USB Characteristics 2.4.1 USBFS Timing 2.4.2 USBCC Characteristics 2.5 ADC12 Characteristics 2.6 TSN Characteristics 2.7 OSC Stop Detect Characteristics 2.8 POR and LVD Characteristics 2.9 Flash Memory Characteristics 2.9.1 Code Flash Memory Characteristics 2.9.2 Data Flash Memory Characteristics 2.10 Serial Wire Debug (SWD) Appendix 1. Port States in each Processing Mode Appendix 2. Package Dimensions Appendix 3. I/O Registers 3.1 Peripheral Base Addresses 3.2 Access Cycles Revision History General Precautions Notice