Datasheet USB4125, USB4130, USB4135 (GCT) - 6
| Manufacturer | GCT |
| Description | Type C USB Charging Connector |
| Pages / Page | 10 / 6 — Part. Rev. Date. Number Product. Page. Description Doc. Prepared. … |
| File Format / Size | PDF / 395 Kb |
| Document Language | English |
Part. Rev. Date. Number Product. Page. Description Doc. Prepared. Checked. Approved. Number. Parameter. Reference. Specification. www.gct.co
Model Line for this Datasheet
Text Version of Document
PRODUCT SPECIFICATION
Part
USB4125, USB4130, USB4135
Rev
A3
Date
20/12/24
Number Product
USB Type C Receptacle, 6 contacts, For Power Charging only
Page
6
Description Doc
USB Type C
Prepared
YR
Checked
CC
Approved
PH
Number
7.0 RESISTANCE TO INFRARED REFLOW SOLDERING HEAT
Parameter Reference Specification
Average temperature gradient in 2.5°C/s preheating Soak time Tsoak 2-3 minutes Time above 217°C T1 60 ss Time above 230°C T2 50 ss Time above 250°C T3 5 ss Peak temperature in reflow Tpeak 255°C(–0/+5°C) Temperature gradient in cooling -5°C/s max Lead Free Process This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat transfer method used for reflow soldering is hot air convection. The actual air temperatures used to achieve the specified profile is higher and largely dependent on the reflow equipment.
www.gct.co
Part
USB4125, USB4130, USB4135
Rev
A3
Date
20/12/24
Number Product
USB Type C Receptacle, 6 contacts, For Power Charging only
Page
6
Description Doc
USB Type C
Prepared
YR
Checked
CC
Approved
PH
Number
7.0 RESISTANCE TO INFRARED REFLOW SOLDERING HEAT
Parameter Reference Specification
Average temperature gradient in 2.5°C/s preheating Soak time Tsoak 2-3 minutes Time above 217°C T1 60 ss Time above 230°C T2 50 ss Time above 250°C T3 5 ss Peak temperature in reflow Tpeak 255°C(–0/+5°C) Temperature gradient in cooling -5°C/s max Lead Free Process This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat transfer method used for reflow soldering is hot air convection. The actual air temperatures used to achieve the specified profile is higher and largely dependent on the reflow equipment.
www.gct.co