Si2333DS Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 20 0.15 10 ) 0.12 Ω( TJ = 150 °C 0.09 ID = 5.3 A TJ = 25 °C esistance -R 1 ID = 2 A - On 0.06 - Source Current (A) on) I S DS(R 0.03 0.1 0.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 V V SD - Source-to-Drain Voltage (V) GS - Gate-to-Source Voltage (V) Source-Drain Diode Forward VoltageOn-Resistance vs. Gate-to-Source Voltage 0.4 12 I 10 0.3 D = 140 µA 0.2 8 riance (V) a 0.1 6 er (W) V w o P GS(th) 0.0 4 V TA = 25 °C - 0.1 2 - 0.2 0 - 50 - 25 0 25 50 75 100 125 150 0.01 0.1 1 10 100 600 T Time (s) J - Temperature (°C) Threshold VoltageSingle Pulse Power 100 I DM Limited Limited by RDS(on)* P(t) = 0.0001 10 P(t) = 0.001 1 P(t) = 0.01 ID(on) Limited P(t) = 0.1 - Drain Current (A) I D T P(t) = 1 A = 25 °C 0.1 Single Pulse P(t) = 10 DC BVDSS Limited 0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area www.vishay.com Document Number: 72023 4 S09-0130-Rev. C, 02-Feb-09