Datasheet STPMIC1 (STMicroelectronics) - 41
| Manufacturer | STMicroelectronics |
| Description | Highly integrated power management IC for micro processor units |
| Pages / Page | 141 / 41 — STPMIC1. Boost converter and power switches. 4.5. Figure 48. Boost and … |
| File Format / Size | PDF / 8.7 Mb |
| Document Language | English |
STPMIC1. Boost converter and power switches. 4.5. Figure 48. Boost and switch block diagram. 4.5.1. Boost converter
Model Line for this Datasheet
Text Version of Document
link to page 4
STPMIC1 Boost converter and power switches 4.5 Boost converter and power switches
The STPMIC1 integrates boost converter and two power switches, primarily dedicated to supply USB sub-system: PWR_USB_SW with 500 mA capability PWR_SW with 1 A capability. For application examples refer to USB sub-system examples.
Figure 48. Boost and switch block diagram 4.5.1 Boost converter
Boost is a synchronous constant on-time step-up converter with fixed 5.2 V output. It is dedicated to power supply USB sub-system (VBUS) with 1.1 A rated output current to supply up to 3 USB ports: x2 USB host port @500 mA + 1 USB OTG port @100 mA. Boost requires 3 small external components only to operate (1 coil LXB, 2 capacitors CVLXBST and CBSTOUT) – there is no external diode required. Refer to: Table 2. Passive components.
Input voltage range
Converter is capable to supply 0.5 A starting from as low as 2.8 V input, and full rated current from 3.3 V input. This allows a wide range of applications to be supported embedding USB host port like Li-Ion/Li-Po battery powered applications or 5 V DC wall adaptor applications.
Bypass feature
Boost integrates an advanced bypass circuitry that allows fast and smooth transition to be performed from boost to bypass operation and reciprocally to keep VBUS in USB compliant tolerance [4.75 V;5.5 V]. This allows USB subsystems to be supplied with standard 5 V DC wall adaptors. • When the wall adaptor voltage is below ~5.2 V (due to its nominal tolerance, load regulation or voltage loss between adaptor and device), the converter works in boost mode • When the wall adaptor voltage is between ~5.2 V to 5.5 V (due to its nominal tolerance or light device load), the converter works in bypass mode
Switching frequency
of converter is 2 MHz in steady-state CCM condition for VIN below ~5 V. During load transient, switching frequency can be temporarily increased/decreased to provide accurate amount of energy needed and minimize the voltage error. For VIN above ~5.2 V or for low load conditions, 2 MHz frequency decreases to optimum.
DS12792
-
Rev 2 page 41/141
Document Outline Features Applications Description 1 Device configuration table 2 Typical application schematic 2.1 Recommended external components 2.2 Pinout and pin description 3 Electrical and timing characteristics 3.1 Absolute maximum ratings 3.2 Thermal characteristics 3.3 Consumption in typical application scenarios 3.4 Electrical and timing parameters 3.5 Application board curves 4 Power regulators and switch description 4.1 Overview 4.2 LDO regulators 4.2.1 LDO regulators - common features 4.2.2 LDO regulators - special features 4.2.3 LDO output voltage settings 4.3 DDR memory sub-system examples 4.3.1 Powering lpDDR2/lpDDR3 memory 4.3.2 Powering DDR3/DDR3L memory 4.4 Buck converters 4.4.1 BUCK general description 4.4.2 BUCK output voltage settings 4.5 Boost converter and power switches 4.5.1 Boost converter 4.5.2 PWR_USB_SW and PWR_SW power switches 4.6 USB sub-system examples 5 Functional description 5.1 Overview 5.2 Functional state machine 5.2.1 Main state machine diagram 5.2.2 State explanations 5.3 POWER_UP, POWER_DOWN sequence 5.4 Feature description 5.4.1 VIN conditions and monitoring 5.4.2 Turn-ON conditions 5.4.3 Turn-OFF conditions and restart_request 5.4.4 Reset and mask_reset option 5.4.5 Power control modes (MAIN / ALTERNATE) 5.4.6 Thermal protection 5.4.7 Overcurrent protection (OCP) 5.4.8 BOOST overvoltage protection 5.4.9 Watchdog feature 5.5 Programming 5.5.1 I2C interface 5.5.2 Non-volatile memory (NVM) 6 Register description 6.1 User register map 6.2 Status registers 6.2.1 Turn-ON status register (TURN_ON_SR) 6.2.2 Turn-OFF status register (TURN_OFF_SR) 6.2.3 Overcurrent protection LDO turn-OFF status register (OCP_LDOS_SR) 6.2.4 Overcurrent protection buck turn-OFF status register (OCP_BUCKS_BSW_SR) 6.2.5 Restart status register (RESTART_SR) 6.2.6 Version status register (VERSION_SR) 6.3 Control registers 6.3.1 Main control register (MAIN_CR) 6.3.2 Pads pull control register (PADS_PULL_CR) 6.3.3 Bucks pull-down control register (BUCKS_PD_CR) 6.3.4 LDO1-4 pull-down control register (LDO14_PD_CR) 6.3.5 LDO5/6 pull-down control register (LDO56_VREF_PD_CR) 6.3.6 PWR_SWOUT and VIN control register (SW_VIN_CR) 6.3.7 PONKEYn turn-OFF control register (PKEY_TURNOFF_CR) 6.3.8 Mask reset Buck control register (BUCKS_MRST_CR) 6.3.9 Mask reset LDO control register (LDOS_MRST_CR) 6.3.10 Watchdog control register (WDG_CR) 6.3.11 Watchdog timer control register (WDG_TMR_CR) 6.3.12 Bucks OCP turn-OFF control register (BUCKS_OCPOFF_CR) 6.3.13 LDO OCP turn-OFF control register (LDOS_OCPOFF_CR) 6.4 Power supplies control registers 6.4.1 BUCKx MAIN mode control registers (BUCKx_MAIN_CR) (x=1…4) 6.4.2 REFDDR MAIN mode control register (REFDDR_MAIN_CR) 6.4.3 LDOx MAIN mode control registers (LDOx_MAIN_CR) (x=1, 2, 5, 6) 6.4.4 LDO3 MAIN mode control register (LDO3_MAIN_CR) 6.4.5 LDO4 MAIN mode control register (LDO4_MAIN_CR) 6.4.6 BUCKx ALTERNATE mode control registers (BUCKx_ALT_CR)(x=1..4) 6.4.7 REFDDR ALTERNATE mode control register (REFDDR_ALT_CR) 6.4.8 LDOx ALTERNATE mode control registers (LDOx_ALT_CR) (x=1, 2, 5, 6) 6.4.9 LDO3 ALTERNATE mode control register (LDO3_ALT_CR) 6.4.10 LDO4 ALTERNATE mode control register (LDO4_ALT_CR) 6.4.11 Boost/switch control register (BST_SW_CR) 6.5 Interrupt registers 6.5.1 Overall interrupt register behavior 6.5.2 Interrupt pending register 1 (INT_PENDING_R1) 6.5.3 Interrupt pending register 2 (INT_PENDING_R2) 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) 6.5.6 Interrupt debug latch registers (INT_DBG_LATCH_Rx) 6.5.7 Interrupt clear registers (INT_CLEAR_Rx) 6.5.8 Interrupt mask registers (INT_MASK_Rx) 6.5.9 Interrupt set mask registers (INT_SET_MASK_Rx) 6.5.10 Interrupt clear mask registers (INT_CLEAR_MASK_Rx) 6.5.11 Interrupt source register 1 (INT_SRC_R1) 6.5.12 Interrupt source register 2 (INT_SRC_R2) 6.5.13 Interrupt source register 3 ( INT_SRC_R3) 6.5.14 Interrupt source register 4 ( INT_SRC_R4) 6.6 NVM registers 6.6.1 NVM status register (NVM_SR) 6.6.2 NVM control register (NVM_CR) 6.7 NVM shadow registers 6.7.1 NVM main control shadow register (NVM_MAIN_CTRL_SHR) 6.7.2 NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR) 6.7.3 NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1) 6.7.4 NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2) 6.7.5 NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR) 6.7.6 NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1 6.7.7 NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2) 6.7.8 NVM device address shadow register (I2C_ADDR_SHR) 7 Package information 7.1 WFQFN 44L (5X6X0.8) package information 8 Marking composition 9 Ordering information Revision history
STPMIC1 Boost converter and power switches 4.5 Boost converter and power switches
The STPMIC1 integrates boost converter and two power switches, primarily dedicated to supply USB sub-system: PWR_USB_SW with 500 mA capability PWR_SW with 1 A capability. For application examples refer to USB sub-system examples.
Figure 48. Boost and switch block diagram 4.5.1 Boost converter
Boost is a synchronous constant on-time step-up converter with fixed 5.2 V output. It is dedicated to power supply USB sub-system (VBUS) with 1.1 A rated output current to supply up to 3 USB ports: x2 USB host port @500 mA + 1 USB OTG port @100 mA. Boost requires 3 small external components only to operate (1 coil LXB, 2 capacitors CVLXBST and CBSTOUT) – there is no external diode required. Refer to: Table 2. Passive components.
Input voltage range
Converter is capable to supply 0.5 A starting from as low as 2.8 V input, and full rated current from 3.3 V input. This allows a wide range of applications to be supported embedding USB host port like Li-Ion/Li-Po battery powered applications or 5 V DC wall adaptor applications.
Bypass feature
Boost integrates an advanced bypass circuitry that allows fast and smooth transition to be performed from boost to bypass operation and reciprocally to keep VBUS in USB compliant tolerance [4.75 V;5.5 V]. This allows USB subsystems to be supplied with standard 5 V DC wall adaptors. • When the wall adaptor voltage is below ~5.2 V (due to its nominal tolerance, load regulation or voltage loss between adaptor and device), the converter works in boost mode • When the wall adaptor voltage is between ~5.2 V to 5.5 V (due to its nominal tolerance or light device load), the converter works in bypass mode
Switching frequency
of converter is 2 MHz in steady-state CCM condition for VIN below ~5 V. During load transient, switching frequency can be temporarily increased/decreased to provide accurate amount of energy needed and minimize the voltage error. For VIN above ~5.2 V or for low load conditions, 2 MHz frequency decreases to optimum.
DS12792
-
Rev 2 page 41/141
Document Outline Features Applications Description 1 Device configuration table 2 Typical application schematic 2.1 Recommended external components 2.2 Pinout and pin description 3 Electrical and timing characteristics 3.1 Absolute maximum ratings 3.2 Thermal characteristics 3.3 Consumption in typical application scenarios 3.4 Electrical and timing parameters 3.5 Application board curves 4 Power regulators and switch description 4.1 Overview 4.2 LDO regulators 4.2.1 LDO regulators - common features 4.2.2 LDO regulators - special features 4.2.3 LDO output voltage settings 4.3 DDR memory sub-system examples 4.3.1 Powering lpDDR2/lpDDR3 memory 4.3.2 Powering DDR3/DDR3L memory 4.4 Buck converters 4.4.1 BUCK general description 4.4.2 BUCK output voltage settings 4.5 Boost converter and power switches 4.5.1 Boost converter 4.5.2 PWR_USB_SW and PWR_SW power switches 4.6 USB sub-system examples 5 Functional description 5.1 Overview 5.2 Functional state machine 5.2.1 Main state machine diagram 5.2.2 State explanations 5.3 POWER_UP, POWER_DOWN sequence 5.4 Feature description 5.4.1 VIN conditions and monitoring 5.4.2 Turn-ON conditions 5.4.3 Turn-OFF conditions and restart_request 5.4.4 Reset and mask_reset option 5.4.5 Power control modes (MAIN / ALTERNATE) 5.4.6 Thermal protection 5.4.7 Overcurrent protection (OCP) 5.4.8 BOOST overvoltage protection 5.4.9 Watchdog feature 5.5 Programming 5.5.1 I2C interface 5.5.2 Non-volatile memory (NVM) 6 Register description 6.1 User register map 6.2 Status registers 6.2.1 Turn-ON status register (TURN_ON_SR) 6.2.2 Turn-OFF status register (TURN_OFF_SR) 6.2.3 Overcurrent protection LDO turn-OFF status register (OCP_LDOS_SR) 6.2.4 Overcurrent protection buck turn-OFF status register (OCP_BUCKS_BSW_SR) 6.2.5 Restart status register (RESTART_SR) 6.2.6 Version status register (VERSION_SR) 6.3 Control registers 6.3.1 Main control register (MAIN_CR) 6.3.2 Pads pull control register (PADS_PULL_CR) 6.3.3 Bucks pull-down control register (BUCKS_PD_CR) 6.3.4 LDO1-4 pull-down control register (LDO14_PD_CR) 6.3.5 LDO5/6 pull-down control register (LDO56_VREF_PD_CR) 6.3.6 PWR_SWOUT and VIN control register (SW_VIN_CR) 6.3.7 PONKEYn turn-OFF control register (PKEY_TURNOFF_CR) 6.3.8 Mask reset Buck control register (BUCKS_MRST_CR) 6.3.9 Mask reset LDO control register (LDOS_MRST_CR) 6.3.10 Watchdog control register (WDG_CR) 6.3.11 Watchdog timer control register (WDG_TMR_CR) 6.3.12 Bucks OCP turn-OFF control register (BUCKS_OCPOFF_CR) 6.3.13 LDO OCP turn-OFF control register (LDOS_OCPOFF_CR) 6.4 Power supplies control registers 6.4.1 BUCKx MAIN mode control registers (BUCKx_MAIN_CR) (x=1…4) 6.4.2 REFDDR MAIN mode control register (REFDDR_MAIN_CR) 6.4.3 LDOx MAIN mode control registers (LDOx_MAIN_CR) (x=1, 2, 5, 6) 6.4.4 LDO3 MAIN mode control register (LDO3_MAIN_CR) 6.4.5 LDO4 MAIN mode control register (LDO4_MAIN_CR) 6.4.6 BUCKx ALTERNATE mode control registers (BUCKx_ALT_CR)(x=1..4) 6.4.7 REFDDR ALTERNATE mode control register (REFDDR_ALT_CR) 6.4.8 LDOx ALTERNATE mode control registers (LDOx_ALT_CR) (x=1, 2, 5, 6) 6.4.9 LDO3 ALTERNATE mode control register (LDO3_ALT_CR) 6.4.10 LDO4 ALTERNATE mode control register (LDO4_ALT_CR) 6.4.11 Boost/switch control register (BST_SW_CR) 6.5 Interrupt registers 6.5.1 Overall interrupt register behavior 6.5.2 Interrupt pending register 1 (INT_PENDING_R1) 6.5.3 Interrupt pending register 2 (INT_PENDING_R2) 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) 6.5.6 Interrupt debug latch registers (INT_DBG_LATCH_Rx) 6.5.7 Interrupt clear registers (INT_CLEAR_Rx) 6.5.8 Interrupt mask registers (INT_MASK_Rx) 6.5.9 Interrupt set mask registers (INT_SET_MASK_Rx) 6.5.10 Interrupt clear mask registers (INT_CLEAR_MASK_Rx) 6.5.11 Interrupt source register 1 (INT_SRC_R1) 6.5.12 Interrupt source register 2 (INT_SRC_R2) 6.5.13 Interrupt source register 3 ( INT_SRC_R3) 6.5.14 Interrupt source register 4 ( INT_SRC_R4) 6.6 NVM registers 6.6.1 NVM status register (NVM_SR) 6.6.2 NVM control register (NVM_CR) 6.7 NVM shadow registers 6.7.1 NVM main control shadow register (NVM_MAIN_CTRL_SHR) 6.7.2 NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR) 6.7.3 NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1) 6.7.4 NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2) 6.7.5 NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR) 6.7.6 NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1 6.7.7 NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2) 6.7.8 NVM device address shadow register (I2C_ADDR_SHR) 7 Package information 7.1 WFQFN 44L (5X6X0.8) package information 8 Marking composition 9 Ordering information Revision history
