NXP Adds Mesh Capability in Bluetooth Smart Solution to Enhance IoT Experiences

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NXP Semiconductors announced it added low power mesh compatibility into its Bluetooth® Smart portfolio, recently acquired from Quintic’s Bluetooth Low Energy (BTLE) and wearable businesses. The new capabilities will enhance the company’s Bluetooth offerings which are subset solutions from the company’s low power connectivity standards relevant to the IoT, including NFC, ZigBee and Bluetooth Smart.

With mesh capability in its Bluetooth Smart solutions, NXP offers developers and manufacturers multi-node communication when developing devices and appliances for the smart home which include lighting, sensors, thermostats or other home Bluetooth Smart devices. In contrast to flooding in mesh networks, a technique which can generate broadcast storms and increase energy consumption, the NXP low power solution fully synchronizes and routes protocols for efficient end-to-end connection between nodes. The NXP solution achieves order of magnitude improvement on energy efficiency for the whole network. The solution will also feature enhanced security and self-constructed networks with self-healing capability, and future proof layered-mesh architecture to support on top of standard Bluetooth Smart devices as well as over-the-air update capability for upgrading network after deployment.

NXP will showcase its new enhanced features with other Bluetooth demonstrations at Bluetooth World, booth #24, April 14-15 at the Santa Clara Convention Center in California. Asit will deliver a keynote at Bluetooth World about the role of Bluetooth in the IoT space on April 15. For additional information about NXP Bluetooth Smart solutions, please visit click here.

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