Infineon's new 40V OptiMOS™-T2 power MOSFETs combine innovative packaging technology and thin-wafer process technology to deliver best-in-class specifications. The company uses a diffusion soldering die to produce lead-free packages, including TO-263, TO-220 and TO-262. Three OptiMOS™-T2 products are ready for production in these packages: IPB160N04S4-02D (160A in a TO-263 package), IPB100N04S4-02D (100A in a TO-263 package) and IPP/I100N04S4-03D (100A in TO-220 and TO-262 packages).
The new MOSFET series exceeds current RoHS directives on lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives to be implemented after 2014 may require 100-percent lead-free packaging. As the first MOSFETs in the industry to eliminate lead, the stricter, upcoming requirements.
Features
- 100% increase in thermal performance
- 20% reduction in electric resistance (RDS(on))
- Improved quality. Very robust product due to seamless attachment and elimination of solder bleed out; very narrow variation in device performance as every part looks the same.
Applications
- High-power automotive drives for electric power steering or engine cooling fans for instance
