Contributes to reduced power consumption, miniaturization and lower cost of small-capacity motors for refrigerators, other products
Mitsubishi Electric Corporation announced it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances. The module uses a metal oxide semiconductor field effect transistor (MOSFET) switching device featuring low power-on voltage in low current regions. Sales will begin on March 1.
With optimized low-loss-drive ICs and a high-heat dissipation design, the module will help to reduce power consumption, advance miniaturization and lower the cost of inverter systems for small-capacity motor drive applications.

Product Features
Reduced power consumption in small-capacity inverter systems
- Power-on voltage in low current regions is reduced by about 60% compared to Mitsubishi Electric's existing "PS219B2" DIPIPM at 0.5A and 25 degrees Celsius, by employing a MOSFET switching device. 
 - Reduction of recovered-power loss by optimizing the MOSFET process. 
 - Reduction of IC power loss by optimizing the control IC. 
 
High reliability through high-heat dissipation structure
- Suppression of channel temperature rise by reducing power loss of switching device and applying a high-heat dissipation insulation sheet.
 
Cost reduction and miniaturization of final product
- Facilitation of thermal radiation via the high-heat dissipation design. 
 - Reduction of external components thanks to built-in bootstrap diode (BSD) with current limiting resistor.
 
Sale Schedule
| 
             Model 
             | 
            
             Specification 
             | 
            
             Shipment date 
             | 
        
| 
             PSM03S93E5/-A/-C 
             | 
            
             3A/500V 
             | 
            
             March 1, 2013 
             | 
        
| 
             PSM05S93E5/-A/-C 
             | 
            
             5A/500V 
             | 
        
Main Specifications
| 
             Model 
             | 
            
             PSM03S93E5/-A/-C 
             | 
            
             PSM0593E5/-A/-C 
             | 
        
| 
             Specification 
             | 
            
             3A/500V 
             | 
            
             5A/500V 
             | 
        
| 
             Dimensions 
             | 
            
             24 × 38 × 3.5 mm (same as super-mini DIPIPM) 
             | 
        |
| 
             Built-in Chips 
             | 
            
             MOSFET × 6 forming a three-phase bridge, 
            HVIC × 1, LVIC × 1and Bootstrap Diode × 3  | 
        |
| 
             Functions 
             | 
            
             Protection against short circuits, control power-supply undervoltage and 
            over-heating (LVIC monitoring ); and error output  | 
        |
| 
             Others 
             | 
            
             Divided-source-type N-side MOSFET 
             | 
        |
In 1997, Mitsubishi Electric first commercialized its DIPIPM transfer-mold-type intelligent power module, which has contributed greatly to miniaturization and energy-savings in inverter systems. The technology has gained increased importance because annual power consumption has become an important index of energy-saving performance in consumer appliances, such as refrigerators. Needs are increasing for reducing loss in rated power, and also in low current regions where a high percentage of power use is concentrated.