Universal Serial Bus (USB) has become a the industrial standard for portable devices thanks to its plug-and-play ease of use. USB 3.0 supports transfer rates of up to 5Gbit per second, making it around ten times faster than second-generation interfaces. It also consumes around 70 percent less power. However, the new USB port design is especially sensitive to electrostatic discharge (ESD). A mere touch of the hand can induce an electric current, and the energy generated by the discharge can damage the equipment or even render it completely unserviceable. This is not just annoying for equipment users, it can also become a costly problem for manufacturers that can lead to product recalls and subsequent image problems.
The new series of ESD102x damping diodes from Infineon are available in single-, dual- and quad-line packages. They protect equipment from damage by absorbing the energy released through electrostatic discharge on a USB port. With the lowest clamping voltage and the lowest dynamic resistance (0.23Ω) of any product on the market today, the diodes are extremely effective in countering electrostatic discharge. They can absorb energy of up to 20kV, which is significantly more than the 8kV defined in the strictest industry standard IEC 61000-4-2. Despite this exceptional level of protection, the ESD102x series has minimal impact on the signal quality of high-speed connections. With traditional solutions, effective protection comes at the expense of signal integrity, which reduces the quality of high-speed signals.
Infineon has combined the ESD102x series with its most recent package technology. The eTSSLP-2-4, eTSLP-4-10 and TSLP-5-2 packages pave the way for optimum PCB layouts and maximum space savings. With high-speed interfaces in particular, the right component package is crucial for ensuring that signals are transmitted fast and without any loss of quality.
Features
- ESD/transient protection of high speed data lines above and beyond the specifications set down in:
- IEC61000-4-2 (ESD): ±20kV (air/contact)
- IEC61000-4-4 (EFT) ≥ ±50 A / ±2.5 kV (5/50ns)
- IEC61000-4-5 (surge) ≥ ±3.5 A (8/20µs)
- Maximum working voltage: VRWM = 3.3V
- Ultra low capacitance: CL = 0.4pF I/O to GND (typical)
- Extremely low leakage voltage: 1nA (typical)
- Very low clamping voltage: VCL = 8V (typical) at IPP = 16 A
- Very low dynamic resistance: RDYN = 0.19Ω
- Three variants available:
- ESD102-U1-02ELS: Single line in TSSLP-2-4 package
- ESD102-U2-099EL: Dual line in TSLP-4-10 package
- ESD102-U4-05L: Quad line in TSLP-5-2 package
- Pb-free and halogen free package (RoHS compliance)
Applications
- The ESD102x series is specifically designed to protect USB 3.0 interfaces against ESD events. It is targeted at wireless, computing and consumer products like smartphones, notebooks and tablet PCs.
- Thanks to its low parasitic capacitance, the ESD102x series can also be used to protect high transfer rate interfaces such as HDMI1.3/1.4, 10/100/1000 Ethernet, Firewire, DVI, S-ATA, MDDI, MIPI, SWP / NFC or DisplayPort.
