Renesas Electronics Introduces the RX113 Group of 32-Bit Microcontrollers for Healthcare Equipment, Home Appliances and Industrial Equipment with Capacitive Touch Sensing

Renesas RX113

RX113 Microcontrollers Enable Touch Key Operations on Curved or Wet Panels

Renesas Electronics is expanding the use of touch key in healthcare, building automation and home appliance applications with the new RX113 Group of microcontrollers (MCUs). Part of the RX100 Series, the new MCUs offer a single-chip solution with unique touch sensor IP and leading-edge low-power technologies. This enables significantly reduced power, size, and development costs for entry-level devices in these markets, as well as for other cost-sensitive, capacitive touch-based applications for the growing Internet of Things (IoT) market. Renesas' innovative touch sensor intellectual property (IP) core achieves both high noise immunity and high sensitivity, offering touch key operation on wet and curved touch panels.

 Renesas Electronics - RX113

Based on Renesas' industry-leading RX CPU core, the RX113 Group of MCUs delivers the highest performance, lowest power, advanced connectivity and extensive digital signal processing (DSP) capability compared to other entry-level 32-bit MCUs. In addition to a capacitive-touch sensing unit and unprecedented ultra-low power, these full-featured 32-bit MCUs also support LCD control, USB 2.0, audio and more. The RX113 devices support multiple memory configurations and communications peripherals to keep pace with expanding embedded systems design requirements, including:

  • Up to 512 KB of flash memory and 64 KB of SRAM
  • Segment LCD control/drive capability up to 288 segments for support of the latest system displays
  • I2S for audio processing, SSI (Serial Sound Interface) and SPI (serial peripheral interface) protocols
  • 12-bit ADC (analog-to-digital converter) with internal voltage reference, and a 12-bit DAC (digital-to-analog converter) and a temperature sensor
  • Complete DSP Processing capability, including Hardware-based Divide, for efficient near-sensor processing

Innovative Capacitive Touch Sensing Technology Provides Superior Features and Capabilities

The RX113 MCUs support both mutual- and self-capacitance methods for key manipulation detection. The Capacitive Touch sensing unit supports up to 36 channels of key input (in mutual-capacitance mode). The self-capacitance method provides significantly improved noise immunity and sensitivity compared to previous implementations. The new MCUs also support Renesas Electronics' first mutual-capacitance method, which allows touch key operation even when the user is wearing gloves and is highly resistant to incorrect detection even when there is water on the touch key area itself. The Capacitive Touch sensing unit supports acrylic panels over 10 mm thick, which allows for flexible designs, such as those using curved panels, to be implemented. Renesas has improved the sensitivity by approximately 5 times, enabling user interfaces with non-traditional surfaces (e.g., wet panels or gloves) to be implemented.

True Low Power Technology

The RX Family delivers flexible power management and optimum power consumption for all use cases. The 32-bit RX113 MCUs achieve the industry's highest level of power efficiency, featuring operating mode power consumption as low as 0.1 mA/MHz (typical) and only 0.44 µA power consumption in low-power mode (RAM contents retained). They also achieve power consumption as low as 1.6 µA in LCD drive mode (internal step-up and 1/3 bias operation).

The RX113 Group has three different run modes, three low-power modes and a flexible clock system. For instance, the Low Power Fast Wakeup capability enables the MCUs to operate at 0.1 mA/MHz in Run Mode and 0.44 µA in software standby from which it can wake-up in only 4.8 µs. It integrates a Zero Wait State Flash with Erase/Write as low as 1.8 V, 1 KB erase block size and background operation (BGO), and offers erase times as low as 10 ms per block.

Development Ecosystem

Samples of the RX113 MCUs are available now in package pin counts ranging from 64 to 100 pins and on-chip flash memory capacities ranging from 128 to 512 kilobytes (KB) for a total of twelve individual products. Mass production is scheduled to begin in February 2015 and is expected to reach a combined volume of 1,000,000 units per month by January 2016. (Availability is subject to change without notice.)

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