Ultra-small transistor delivers unrivalled performance while saving PCB space
NXP Semiconductors announced the industry’s first medium power transistors in a 2-mm × 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor.
Ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the new DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 Amps. When mounted on state-of-the-art 4-layer PCBs, its thermal performance matches much bigger standard SMD packages and allows Ptot levels of up to 1.1 W in a tiny footprint. Driven by miniaturization in chip design, NXP’s ultra-compact medium power transistors offer design engineers a flexible power transistor solution for designs focusing on space saving, energy efficiency, and low heat dissipation. All NXP medium power transistors are automotive-qualified according to AEC-Q101.
Key Features of NXP Medium Power Transistors
- High current in a small leadless package with medium power capability
- Exposed heat sink for excellent thermal and electrical performance
- VCEO ranging from 20 V to 80 V
- High collector current capability IC (up to 2A) and ICM (up to 3A)
- Automotive AEC Q101 qualified
Pricing and Availability
The new medium power transistors are available now. Pricing in high volume starts at USD $0.10.
