Micron Technology Creates Memory Combination for Mobile Phone Designers with Launch of Multichip Package Line

Micron Technology MT9D112

Micron to Showcase Mobile Portfolio, Including New NAND Flash and Mobile DDR DRAM MCP.

Micron Technology announced its new line of multichip package (MCP) memory for use in feature-rich mobile phones. Driven by the need for increased speed, extended functionality, and reduced package size, feature-rich 2.5G and 3G handset designs require flexible, high-capacity memory subsystems. By combining Micron’s NAND flash memory with its Mobile DRAM featuring Endur-IC™ technology in the same package, designers now have a convenient option to include quality Micron memory direct from the company into their high-performance handset designs.

Micron’s NAND and Mobile DRAM MCP devices are currently sampling to select customers and are expected to be available in 1Gb NAND/512Mb Mobile DDR DRAM configurations for production in Q4 2006.

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