New TI SimpleLink™ MCU platform devices offer advanced integration for concurrent multi-standard and multi-band connectivity
To meet growing connectivity needs for buildings, factories and the grid, Texas Instruments (TI) introduced its newest SimpleLink™ wireless and wired microcontrollers (MCUs). These new devices offer industry-leading low power consumption and concurrent multi-standard and multi-band connectivity for Thread, Zigbee®, Bluetooth® 5 and Sub-1 GHz. With more memory and unlimited connectivity options, the expanded SimpleLink MCU platform offers designers 100 percent code reuse across TI's ARM® Cortex®-M4-based MCUs to enhance and connect sensor networks to the cloud.
New SimpleLink MCUs support the following wireless connectivity options:
- Sub-1 GHz:
CC1312R wireless MCU.
- Multi-band:
(Sub-1 GHz, Bluetooth low energy, Thread and Zigbee): CC1352R and CC1352P wireless MCUs.
- Bluetooth low energy:
CC2642R wireless MCU.
- Multi-standard:
(Bluetooth low energy, Thread and Zigbee): CC2652R wireless MCU.
- Host MCU with up to 2 MB of memory:
MSP432P4 MCUs.
Key features and benefits of the new SimpleLink MCUs
- The lowest power:
The new wireless and host MCUs consistently achieve the lowest power in the industry, more than 10 years on a coin-cell battery, and now offer a newly enhanced low-power sensor controller with current consumption as low as 1.5 µA for a 100 Hz comparator reading.
- More than 10 connectivity protocols:
The expanded SimpleLink MCU platform supports a variety of connectivity protocols and standards for 2.4 GHz and Sub-1 GHz bands, including the latest Thread and Zigbee standards, Bluetooth low energy, IEEE 802.15.4g, Wireless M-Bus and more.
- Option for extended range:
With the multi-band CC1352P wireless MCU, developers can extend range even further for metering and building automation applications using its integrated power amplifier with high output power of +20-dBm and transmit current as low as 60 mA.
- 2 MB of flash memory:
New SimpleLink MSP432P4 MCUs, with an integrated 16-bit precision ADC, give developers eight times more code space and the ability to host multiple wireless connectivity stacks and a 320-segment liquid crystal display (LCD) with extended temperature range for industrial applications.
- Enhanced security features:
The CC13x2 and CC26x2 wireless MCUs offer new security hardware accelerators for the following encryption protocols: AES-128/256, SHA2-512, Elliptic Curve Cryptography (ECC), RSA-2048 and true random number generator (TRNG).
- Code compatibility:
These new products are all supported by the SimpleLink software development kit (SDK) and provide a unified framework for platform extension through 100 percent application code reuse.
To assist in developing with the SimpleLink MCU platform, TI offers the SimpleLink Academy, a comprehensive and interactive learning experience with overviews and training tutorials on the supported industry standards and technologies.
Availability and pricing
Developers can get started immediately with SimpleLink MCU-based TI LaunchPad™ development kits available through the TI store and authorized distributors. The LAUNCHXL-CC26X2R1, LAUNCHXL-CC1312R1 and LAUNCHXL-CC1352R1 are available for US$39.99. The MSP-EXP432P4111 is available for US$17.99.
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| LaunchPad kit with CC1312 MCU (LAUNCHXL-CC1312R1). |
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| MSP432P4111 SimpleLink Microcontroller LaunchPad Development Kit (MSP-EXP432P4111). |
TI's new SimpleLink MCU devices are available through the TI store and authorized distributors with packages and pricing as listed in the table below.
| Device name | Package | Pricing in 1,000-unit quantities |
| CC1312R | 7 mm2 QFN | $3.89 |
| CC1352R | 7 mm2 QFN | $4.73 |
| CC1352P | 7 mm2 QFN | $5.25 |
| CC2652R | 7 mm2 QFN | $3.05 |
| CC2642R | 7 mm2 QFN | $2.65 |
| MSP432P4x1V | 9 mm2 QFN 16×16 LQFP |
$4.50 |
| MSP432P4x1Y | $5.18 | |
| MSP432P4x11 | $5.99 |
