News & Press Releases Samsung

Manufacturer: "Samsung"
Search results: 27 Output: 1-10
  1. Samsung Electronics, as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s ...
    07-11-2022
  2. Lighting to energize or relax: new LED packages help improve alertness and the quality of sleep by adjusting melatonin levels Samsung Electronics unveiled its first “human-centric” LED packages, collectively known as LM302N . Engineered ...
    07-05-2020
China PCB Prototype and Fabrication Manufacturer
  1. The new PMICs integrate multiple discrete components in one chip to make room for longer battery life and more efficient designs in today’s True Wireless Stereo devices Samsung Electronics announced the industry’s first all-in-one power ...
    10-04-2020
  2. Sensors Video Samsung ISOCELL Bright HMX
    Samsung’s partnership with Xiaomi brings innovation to mobile cameras with new ISOCELL Bright HMX Samsung Electronics introduced 108 megapixel (Mp) Samsung ISOCELL Bright HMX, the first mobile image sensor in the industry to go beyond 100 ...
    27-08-2019
  1. Setting a new threshold for mobile storage to handle ever-increasing amounts of multimedia content Samsung Electronics announced that it has begun mass production of the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage ...
    09-01-2018
  2. Samsung Electronics unveils the industry’s first removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices such as DSLRs, 3D VR cameras, action cams ...
    13-07-2016
  3. Opening the door to “10 nm-class DRAM” for the first time in the industry after overcoming technical challenges in DRAM scaling Samsung Electronics announced that it has begun mass producing the industry’s first 10-nanometer (nm) ...
    22-06-2016
  4. New Samsung DRAM Solution Signals TSV Technology is heading for Mainstream High-Capacity Memory Applications Samsung Electronics announced that it is mass producing the industry’s first “through silicon via” (TSV) double data ...
    10-12-2015
  5. Memory Samsung K90KGY8S7M-CCK0
    Using 10nm-class process technology. Samsung Electronics has begun mass producing a 128, 3-bit MLC NAND memory chip using 10 nm-class process technology this month. The highly advanced chip will enable high-density memory solutions such as embedded ...
    17-04-2013
  6. Memory Samsung 64GB eMMC Pro Class 2000
    Samsung Electronics announced a next-generation 64GB embedded multimedia card (eMMC) using 10 nanometer (nm)-class process technology. The new 64GB NAND memory went into production late last month. Embedded memory is the key memory component in ...
    27-11-2012

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