News & Press Releases Wireless - 4
Subsection: "Wireless"
Search results: 117 Output: 31-40
- TDK Corporation presents the miniaturized TPLC553030-592H automotive transponder coil for tire pressure monitoring systems (TPMS) that operate at a center frequency of 125 kHz. With its dimensions of just 5.5 mm × 3.0 mm × 3.0 mm, the ...14-03-2018
- Highly expandable and integrated device will be fully AEC-Q100 qualified Toshiba Electronics Europe has announced a new IC that is compliant with Bluetooth® Low Energy (LE) [1] core specification 4.2 including support for secure connection, LE ...18-12-2017
- Sigfox RC1 verified SiP provides turnkey RF solution with module-like functionality in an IC form factor for device-to-cloud communications ON Semiconductor has announced a new programmable RF transceiver System in Package (SiP) integrating an ...14-11-2017
- EM Microelectronic, the semiconductor company of the Swatch Group, announces the EM9304, a tiny, low-power, system-on-chip (SoC) optimized for Bluetooth® v4.2 low energy enabled IoT, wearable and smart electronics products. The EM9304 is ...23-01-2017
- Monitor IoT networks from a handheld device with TI's single-chip Sub-1 GHz and Bluetooth® low energy solution available today Expanding the functionality of Internet of Things (IoT) networks, Texas Instruments (TI) announced availability ...15-09-2016
- ESP8266 WiFi modules initially stormed the maker market for IoT applications thanks to their low price, and later it became the dominant WiFi IoT platform for hobbyists thanks to its large community of developers. But technology progresses over ...13-09-2016
- SkyTraq Technology Inc., a fabless GNSS positioning technology company, introduces S2525F8-RTK, a low-cost, low-power, single frequency RTK receiver for applications requiring centimeter-level accuracy positioning. S2525F8-RTK is a ...27-04-2016
- PREMO launches a new 3D-coil with double functionality in both Low Frequency (125 kHz) and High Frequency applications (13.56 MHz). All in one package. In the last few years, Communication technology by Near Field Communications (NFC) has ...16-03-2016
- NXP Semiconductors introduced the MMZ25332B4 InGaP HBT linear amplifier. The device is housed in a 4 mm × 4 mm QFN package that can be used on thicker printed circuit boards (PCB), particularly where thermal sensitivity is high. The ...29-02-2016
- The Bluetooth v4.2 certified nRF52832 is the first of Nordic Semiconductor’s nRF52 Series Systems-on-Chip and is supported by a full range of development kits, software, and documentation, now fully finalized from the previous Beta versions ...26-02-2016
