TI introduces breakthrough high-density power solutions for point-of-load design

Texas Instruments TPS82671 TPS84620

Fully integrated 600-mA solution measures only 6.7 mm2; high-performance 6-A, 14.5-V integrated converter achieves 800 W/in3

DALLAS, Nov. 1, 2010 /PRNewswire via COMTEX News Network/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced two new power management integrated circuits for point-of-load designs that raise the bar for size, power density and performance. TI's TPS82671 and TPS84620 integrated power solutions ease design and speed time-to-market in portable electronics, communications and industrial applications.

"Point-of-load designs require greater power density, high efficiency and ease of use," said Sami Kiriaki, senior vice president of TI's Power Management business. "These two new power devices achieve new levels of integration and performance, and allow us to support a wide range of customers in portable, telecom, base station and industrial markets like never before."

Smallest integrated 600-mA solution

Texas Instruments - TPS82671 Texas Instruments - TPS82671

The TPS82671 is the industry's smallest integrated plug-in power solution at 6.7 mm2, providing 90 milliamps per square millimeter. The device combines all external components in TI's new MicroSiP(TM) package with a 1-mm height -- easing design for 600-mA portable electronics, such as smartphones. The TPS82671 operates at a very low 17-uA quiescent current and achieves power efficiency of greater than 90 percent from an input voltage of 2.3 V to 4.8 V. A unique PWM frequency dithering feature reduces noise and improves performance in radio frequency-sensitive designs. Visit: www.ti.com/tps82761-pr.

Ultra-dense point-of-load

TI's new 6-A, 14.5-V TPS84620 achieves a power density of greater than 800 watts per cubic inch with up to 95 percent efficiency and 30 percent better thermal dissipation than competitors. The integrated step-down solution combines the inductor and passives onto one device, and requires only three external components, resulting in a complete solution in a space less than 200 mm2. The TPS84620 supports a variety of high-power telecom infrastructure and industrial systems that use DSPs and FPGAs. Visit: www.ti.com/tps84620-pr.

Broadest range of point-of-load solutions

TI offers the broadest range of power management ICs for non-isolated point-of-load designs, including step-up and step-down converters for portable and line-powered systems. These range from ultra-low power DC/DC converters with and without integrated FETs to fully integrated power solutions to plug-in power modules.

Availability and pricing

The TPS82671 and TPS84620 are available in volume now from TI and its authorized distributors. The TPS82671 comes in an 8-pin, 2.3-mm x 2.9-mm x 1-mm MicroSiP(TM) BGA package with a suggested resale price of $1.30 in 1,000-unit quantities. The TPS84620 comes in a 15-mm x 9-mm x 2.8-mm QFN package with a suggested resale price of $7.00 in 1,000-unit quantities. Evaluation modules for both devices are available through TI's eStore.


1-4 Layer PCBs $2

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