Texas Instruments (TI) unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs.
TI’s new isolated power modules with proprietary IsoShield technology pack more power into smaller spaces while reducing area, cost and weight.
Redefining power density with TI's packaging technology
Historically, power designers have turned to power modules to conserve valuable board space and simplify the design process. As chip sizes reach their physical limits and miniaturization increases in importance, advancements in packaging technology are enabling further performance and efficiency gains.
TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2 W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation.
| Part number | Package size | Voltage |
| UCC34141-Q1 | 5.85 mm × 7.5 mm × 2.6 mm | Mid voltage (6 V-20 V) |
| UCC33420 | 4 mm × 5 mm × 1 mm | Low voltage (5 V) |
Availability
Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available.
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| The UCC34141EVM-116 evaluation module. |