News & Press Releases: 2014 - 6

51. Microchip Announces First Embedded Firmware Development Framework With Internal and 3rd Party Support, Licensing and Resale
    CAD & Software Microchip MPLAB Harmony
    .. PIC32MX families. Full support for all PIC32 families is planned for the next version release, which is expected in March 2014. microchip.com
    Dec 26, 2013

52. Fourth Generation High Voltage Amplifier IC Continues to Deliver Industry Innovation in Three New Single Channel and Dual Channel Designs
    Drivers Amplifiers High Voltage Power Apex PA441DF PA441DW PA443DF
    .. for the PA441DF is $7.98 USD in 1,000 quantities. Both the PA441DW and PA443DF will be available for evaluation in Q1 2014. The EK13 is the development kit for both the PA441DF and PA443DF and includes a PCB and heatsink. The EK42 can ...
    Dec 18, 2013

53. Freescale Introduces Robust, High-Speed CAN Transceivers for Industrial and Automotive Applications
    Interfaces Automotive Freescale MC33901 MC34901
    .. networks (MC34901) Development support and availability The MC33901 and MC34901 devices are planned for availability in Q2 2014. The majority of Freescale's analog products meet critical industrial market requirements, including operation ...
    Dec 16, 2013
54. Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology
    Supply Power Solar STMicroelectronics SPV1050
    .. to prevent excessive discharging for longer battery life. The SPV1050 is sampling now and scheduled for production in Q1 2014. It is available in a 20-lead QFN 3 × 3 × 1mm package or in 20-bump WLCSP tested and unsawn wafers. ...
    Dec 15, 2013
55. u-blox launches EVA-7M, industry's smallest standalone GNSS module
    Wireless Wireless u-blox EVA-7M
    .. module is suitable for consumer, industrial and after-market vehicle applications. First samples will be available in Q1 2014. u-blox.com
    Dec 15, 2013
56. NXP Launches ESD Protection Diodes for NFC Antennas
    Discretes NXP PESD18VF1BL PESD24VF1BL
    .. is US $0.05 per piece in quantities of 10,000 units. The PESD24VF1BL will be available in high-volume production in Q1 2014. Two further 18 V and 24 V protection diodes in the DSN0603 (0.6 × 0.3 × 0.3 mm, 0201 inch) package ...
    Dec 2, 2013
57. Analog Devices Introduces the Industry's Lowest Power Digital Isolators
    Electronic components Analog Devices ADuM144x
    .. Product Availability Price (1K units) Package ADuM144xARQZ Now $1.98 4 mm × 5 mm, 16-lead QSOP ADuM144xARSZ January 2014 $2.48 7.2 mm × 5.3 mm, 20-lead SSOP Eval Board Now $49.00 EVAL-ADuM144xQSOP16-EBZ Evaluation Board. ...
    Nov 27, 2013
58. Microchip's PIC32MZ 32-bit MCUs Have Class-Leading Performance of 330 DMIPS and 3.28 CoreMarks/MHz; 30% Better Code Density
    Microcontrollers Microchip PIC32MZ
    .. the remaining 12, along with additional package options, are expected to become available at various dates through May 2014. The crypto engine is integrated into eight of the PIC32MZ MCUs, and there is an even split of 12 MCUs with 1 MB ...
    Nov 23, 2013
59. Fujitsu Releases New 4 Mbit FRAM with Non-Volatile Memory with SRAM-Compatible Parallel Interface
    Memory Fujitsu Semiconductor MB85R4M2T
    .. with an SRAM-compatible parallel interface. The new product will be made available in sample quantities starting January 2014. It uses a 44-pin TSOP package compatible with standard low-power SRAM, so it can substitute for SRAM in ...
    Nov 19, 2013
60. Designed for Big Data Applications, AMD Announces Industry's First "Supercomputing" Server Graphics Card with 12GB Memory
    Computers & Peripherals AMD FirePro S10000
    .. latest AMD Graphics Core Next (GCN) architecture. AMD FirePro S10000 12GB Edition GPU is slated for availability in Spring 2014. The AMD FirePro S10000 12GB Edition graphics card is a compelling solution for a variety of scenarios: ...
    Nov 18, 2013

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