News & Press Releases: 2014

Search for: "2014"
Search results: 91 Output: 1-10
  1. .. for observing the earth with the ALOS-2, which Mitsubishi Electric delivered to the Japan Aerospace Exploration Agency in 2014 and is now in operation. Supporting legs, made extra thin thanks to microfabrication technique, convey energy ...
    21-08-2019
  1. .. existed for decades, Ikalogic didn’t have the exact same definition of “portability” and ergonomics. In 2014, Ikalogic started working on a totally new oscilloscope concept: IkaScope. Meet the world’s first wifi ...
    05-03-2018
  1. .. on the host device, read and write conditions, and file size. [6] Toshiba Memory Corporation survey using MobileMark 2014 under Toshiba Memory Corporation test conditions. [7] Availability of the SED model line-up may vary by region. * ...
    18-01-2018
  2. CAD & Software Mentor Graphics PADS MakerPro PADS Maker
    .. Dunn EDN For the second time in recent years, Mentor is taking a stab at entry-level PCB CAD. In late 2014, EDN reported on a Mentor-DigiKey collaboration called Designer that was to bring lower-midrange capabilities to ...
    09-06-2017
  3. Electronic components Optoelectronics Light Seoul Semiconductor SFW8C32A-xx SFW8C32A-xx SFW8C32A-xx SFW8C31A-xx SFW8C31A-xx SFW8C52A-xx
    .. hotels or even bed- and living rooms, making them an alternative to incandescent light bulbs that have been phased out in 2014. Development of this technology at Seoul Semiconductor started already in the early 2000s, even before there was ...
    12-03-2017
  4. .. Silicon Radio, a maker of wireless chips for cars and household devices. Mollenkopf, who took over as chief executive in 2014, was behind both those deals. And with more than $30 billion in cash at its disposal, he had plenty of ammunition ...
    29-10-2016
  5. .. (1x) DRAM marks yet another milestone for the company after it first mass produced 20-nanometer (nm) 4Gb DDR3 DRAM in 2014. Samsung’s leading-edge 10 nm-class 8 Gb DDR4 DRAM significantly improves the wafer productivity of 20 nm 8 ...
    22-06-2016
  6. .. enterprise servers and data centers. Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64 GB) in 2014, the company’s new TSV registered dual inline memory module (RDIMM) marks another breakthrough that opens ...
    10-12-2015
  7. .. (Antwerp, Belgium) open source USB oscilloscope, SmartScope, is the result of a Kickstarter campaign commenced in 2014 the project raised 645% of the funding goal within 30 days. Believed to be the first test equipment designed to ...
    10-11-2015
  8. Memory Cypress S26KL256S
    .. controllers. This provides OEMs the ability to offer different product models with a single design. Originally announced in 2014, the HyperBus interface is supported by an increasing number of chipset suppliers adopting the HyperBus ...
    13-08-2015

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