News & Press Releases - Electronic components - 8

Subsection: "Electronic components"
Search results: 519 Output: 71-80
  1. New packaging design provides 1.7 times higher rupture resistance than conventional press-pack packaging Toshiba Electronics Europe will be providing details on its new packaging for its 4.5 kV class press-pack IEGT (PPI) devices at PCIM 2018 in ...
    Jun 13, 2018
  2. Electronic components Broadcom BCM88476 BCM88470 BCM88270
    Broadcom announced two new product families in the StrataDNX™ line of switch system-on-chip (SoC) devices. Building on the industry’s most pervasive silicon platform for service provider networking, the new products extend StrataDNX ...
    Jun 7, 2018
  1. Achieve ultra-low jitter at high frequencies Epson Europe Electronics offers EV7050 Voltage-Controlled SAW Oscillator. Designed for high-speed optical links, EV7050 VCSOs achieve extremely low jitter of 18 fs 12 kHz - 20 MHz at high frequency of ...
    May 24, 2018
  2. EM Microelectronic announced the release of its EM3028 Extreme low power Real-Time Clock (RTC) module, setting a new industry benchmark for accuracy and power consumption. EM3028 leads the way for green IoT applications, with 50% extended battery ...
    May 24, 2018
  3. Electronic components Nexperia 74AHC1G4210 74AHC1G4212 74AHC1G4214
    New range of overvoltage-tolerant AHC Logic dividers increase flexibility and reliability Nexperia, the former Standard Products division of NXP , announced a new range of AHC (Advanced High speed CMOS) dividers with oscillators that save space, ...
    Mar 5, 2018
  4. TI's new operational amplifier and comparators reduce overall system footprint in IoT, personal electronics and industrial applications Texas Instruments (TI) introduced the industry's smallest operational amplifier (op amp) and low-power ...
    Feb 27, 2018
  5. Analog Devices announces the Power by Linear™ LTC3351 , a supercapacitor charger and backup power controller IC that includes hot swap front-end protection and all the features necessary to provide a complete, standalone capacitor-based ...
    Feb 21, 2018
  6. Dialog’s latest CMICs feature In-System Programming and Multi-Time programming to simplify modifications late in the design cycle, in-field or on the production line Dialog Semiconductor launched the GreenPAK™ SLG46824 and SLG46826 , ...
    Jan 18, 2018
  7. Highly integrated 4-channel linear audio amp uses patented technology to reduce power consumption by 90% Toshiba Electronics Europe has developed a 4-channel, high-efficiency class-AB linear power amplifier IC that delivers high-quality sound ...
    Dec 13, 2017
  8. A total of 11 new products deliver additional functionality and 40% power saving Toshiba Electronics Europe announced that it is adding 11 products to its line-up of new-generation transistor arrays equipped with DMOS FET outputs, capable of ...
    Dec 4, 2017