News & Press Releases Electronic components - 4

Subsection: "Electronic components"
Search results: 506 Output: 31-40
  1. ZSSC4175 addresses automakers’ need to improve fuel efficiency and meet increasingly stringent emissions regulations. Integrated Device Technology (IDT), a wholly owned subsidiary of Renesas Electronics Corporation, has launched its new ...
    24-07-2019
  2. As compute-intensive, vision-based systems are increasingly integrated at the network edge, Field Programmable Gate Arrays (FPGAs) are quickly becoming a preferred flexible platform for next-generation designs. In addition to requiring high ...
    17-07-2019
  3. Diodes Incorporated announced the PI3A6386 USB Type-C™ multimedia port switch, designed to enable manufacturers to continue supporting legacy data and analog peripherals through USB Type-C ports. As a result of the adoption of USB Type-C ...
    13-06-2019
  4. Electronic components IDT ProXO XF ProXO XP
    ProXO devices combine programmability with high performance, low power, flexibility and the industry’s smallest form factors Integrated Device Technology (IDT), a wholly owned subsidiary of Renesas Electronics Corporation announced the ...
    28-05-2019
  1. Asahi Kasei Microdevices Corporation, (AKM), released the AK7604 , an audio processor optimized for processing high resolution music sources in automotive sound systems. A portion of the specifications from the DSP core, Audio I/O, A/D converter, ...
    29-04-2019
  2. Electronic components ABLIC S-35710M I S-35710 I S-35720 I
    Ultra-low Power Consumption and Highly Flexible Wake-up Time Settings Facilitate Intermittent System Operation ABLIC Inc. launched the S-35710 / 20 (I-Series), a wake-up timer IC with ultra-low power consumption that allows flexible wake-up time ...
    23-04-2019
  3. The new MLX90641 extends critical figures of merit to further advance Melexis’ technical lead in far infrared sensing Melexis announces a new version of its popular far infrared (FIR) thermal sensor array. The new device has lower thermal ...
    09-04-2019
  4. AS6500 in small 6 mm × 6 mm package measures time intervals to a resolution of 10 ps ams has introduced the AS6500 , a new high-resolution time-to-digital converter (TDC) featuring CMOS inputs and compact packaging for use in space- and ...
    29-03-2019
  5. Electronic components Measurement Silicon Labs Si8921 Si8922 Si8931 Si8932 Si8935 Si8936 Si8937 Si8941 Si8946 Si8947
    Silicon Labs' Robust Third-Generation Isolation Technology Delivers a Leap Forward in Performance and Stability Silicon Labs has introduced a family of isolated analog amplifiers, voltage sensors and delta-sigma modulator (DSM) devices designed ...
    27-03-2019
  6. The Broadcom® BCM8956X family of devices is Broadcom's fifth generation of fully integrated L2+ multilayer switch solutions to support automotive qualification (AEC-Q100) and temperature grade for in-car networking applications. The ...
    24-03-2019
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