News & Press Releases - Electronic components - 7

Epson Europe Electronics GmbH (Epson) presents the M-series TCXOs TG2016SMN (2.0 × 1.6 mm 2 ) and TG2520SMN (2.5 × 2.0 mm 2 ) that are designed for wireless applications such as Wi-Fi, GPS, cellular, LPWA for IoT, and 2-way radio. The ...

Targeted for MEMS based pressure sensor modules Micro Analog Systems Oy announced MAS6505 , a 22-bit Piezoresistive Sensor Signal Interface IC primarily intended for MEMS based pressure sensor modules. The device uses analog front-end (AFE) ...

BCD8s-SOI technology assures high quality and performance at minimal Bill-of-Material costs Chips uniquely integrate beamforming and, with 16 channels, a high-voltage stage, and internal memory, offer the flexibility to address multiple platforms ...

New device enables simple and easy switching of multi-pole motors Toshiba Electronics Europe announced the launch of a new three-phase brushless fan motor controller IC for white good that realizes a high efficiency drive and noise reduction. ...

Analog Devices (ADI) introduced an energy metering IC with autocalibration for single-phase energy measurement applications. The new ADE9153A uses m Sure® technology to automatically calibrate the measurement system, significantly reducing ...

CML Microcircuits is pleased to offer a new product from its Sicomm Technologies design centre. Strengthening CML’s presence in the Mobile Radio market, the SCT3258TD is a highly integrated baseband solution that includes both DMR and dPMR ...

Analog Devices (ADI) announced three enhanced Automotive Audio Bus (A 2 B®) transceivers that deliver unprecedented capability to tailor system-level performance to even the most stringent electromagnetic compatibility (EMC) requirements. The ...

Small size, low on resistance and AEC-Q101 qualification Toshiba Electronics Europe has announced the launch of a new MOSFET series that incorporates an active-clamp structure with a built-in diode between the drain and gate terminals. With the ...

New packaging design provides 1.7 times higher rupture resistance than conventional press-pack packaging Toshiba Electronics Europe will be providing details on its new packaging for its 4.5 kV class press-pack IEGT (PPI) devices at PCIM 2018 in ...

Broadcom announced two new product families in the StrataDNX™ line of switch system-on-chip (SoC) devices. Building on the industry’s most pervasive silicon platform for service provider networking, the new products extend StrataDNX ...